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Fast integrated circuits for wireline communications

Course No.: L.048.25019

Type: V2, Ü2

Credits: 6

Semester: Winter semester

Schedule and Location:

Informations on Schedule and Room can be found on PAUL

Short description 

Nowadays commercial fiber-optic communication systems reach very high data rates of 100 Gb/s per optical channel and several Tb/s in a single fiber. In a similar way very high data rates of more than 10 Gb/s occur at a single package pin of electronic chips. These signals are to be transmitted over printed circuit boards and inexpensive serial cables. In the future the progress of CMOS technology and communication technology will push speed of fiber-optic and wire-line communication continuously to ever higher data rates.

The design of electronic circuits for high bandwidth rsp. data rates requires a good system knowledge with respect to typical transmitter and receiver architectures, components, and signal properties. Furthermore a thorough understanding of integrated circuit design as well as precise high-frequency modeling of passive and active devices are required.

Goal of the lecture is to enable the student to utilize a methodological approach for the design of fast integrated electronic circuits for digital wired communications. A part of the exercises will be carried out using modern industry-standard IC design software.

As part of the lecture a 2-day excursion to IHP Leibnizinstitute for High-Performance Microelectronics in Frankfurt (Oder) is offered which includes the visit of a modern chip fabrication facility (participation in the excursion is voluntary).

In the Master Electrical Engineering the course can be allowed within the study models Microelectronics, Optoelectronics, and Communication Technology. In the Master Electrical Systems Engineering the course is allowed as elective course for the Electronics and Devices track and in Master Computer Engineering as elective course for the specialization in Embedded Systems and Nano-/Microelectronics.

Content:

    • Transmitter and receiver architectures for fiber-optic communications
    • Transmitter and receiver architectures for chip-to-chip communications
    • System theory fundamentals
    • Broadband signals in time and frequency domain
    • Behavior of band-limited linear systems
    • Signal degeneration (ISI, jitter, noise)
    • Semiconductor technologies and integrated high-frequency devices
    • Amplifiers for digital broadband signals
    • Logic circuits in current-mode-logic (CML)
    • Transmitter and receiver components
    • PLL technique for frequency synthesis and clock recovery
    • Measurement techniques

    Literature:

    • E. Säckinger, “Broadband Circuits for Optical Fiber Communication”, Wiley, 2005
    • B. Razavi, “Design of Integrated Circuits for Optical Communications”, McGraw-Hill, 2003
    Transimpedanz amplifier (Block schematic)
    Transimpedanz amplifier (Chipfoto)