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Brinkmann, André;Niemann, Jörg-Christian;Hehemann, Ingo;Langen, Dominik;Porrmann, Mario;Rückert, Ulrich:

On-Chip Interconnects for Next Generation System-on-Chips.

In: Proc. of the 15th Annual IEEE International ASIC/SOC Conference, pp. 212-215, Rochester, NY, USA, Sep 25 - 28, 2002

Abstract

TodayŽs deep submicron fabrication technologies enable design engineers to put an impressive number of components like microprocessors, memories, and interfaces on a single microchip. With the emergence of 100 nm processes, billions of transistors can be integrated on one die and form a parallel system, consisting out of thousands of components. To handle this impressive number of components it is important to provide a communication infrastructure which is able to scale with the capabilities of upcoming fabrication technologies and which provides the foundation for efficient on-chip communication protocols. This paper addresses the architectural requirements which are coupled with the transfer of well known techniques from parallel computers onto the design of SoCs and proposes an on-chip architecture which is based on active switch boxes. We will show that this architecture is able to fill the existing design gap between an efficient use of the design space and the design complexity with reasonable resource requirements.

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Bibtex

@inproceedings{hniid=407,
author = {Brinkmann, André and Niemann, J{\"o}rg-Christian and Hehemann, Ingo and Langen, Dominik and Porrmann, Mario and R{\"u}ckert, Ulrich},
title = {On-Chip Interconnects for Next Generation System-on-Chips},
booktitle = {Proc. of the 15th Annual IEEE International ASIC/SOC Conference},
pages = {212-215},
address = {Rochester, NY, USA},
month = {25~-~28~} # sep,
year = {2002},
}

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https://www.hni.uni-paderborn.de/pub/407